DIFF Subgroup
H05K 3/06 the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Introduced: September 1968
Full Title
Apparatus or processes for manufacturing printed circuits > in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding > the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
CPC subdivides this area 4x more granularly than IPC with 3 additional codes.
3 codes are CPC-only extensions.
IPC defines codes here since 1980.
Child Classifications
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