in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Child Classifications

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• H05K 3/022 +1 CPC CPC only CPC only
• H05K 3/027 CPC only CPC only
• H05K 3/04 the conductive material being removed mechanically, e.g. by punching +4 CPC IPC+CPC Available in IPC and CPC
• H05K 3/06 the conductive material being removed chemically or electrolytically, e.g. by photo-etch process +3 CPC IPC+CPC Available in IPC and CPC
• H05K 3/08 the conductive material being removed by electric discharge, e.g. by spark erosion IPC+CPC Available in IPC and CPC