DIFF Subgroup
H05K 3/02 in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
Introduced: September 1968
Full Title
Apparatus or processes for manufacturing printed circuits > in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
Of 5 combined children, 3 exist in both systems.
2 codes are CPC-only extensions.
Child Classifications
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- H05K 3/04 the conductive material being removed mechanically, e.g. by punching +4 CPC IPC+CPC Available in IPC and CPC
- H05K 3/06 the conductive material being removed chemically or electrolytically, e.g. by photo-etch process +3 CPC IPC+CPC Available in IPC and CPC
- H05K 3/08 the conductive material being removed by electric discharge, e.g. by spark erosion IPC+CPC Available in IPC and CPC