DIFF Subgroup
H05K 3/34 by soldering
Introduced: September 1968
Full Title
Apparatus or processes for manufacturing printed circuits > Assembling printed circuits with electric components, e.g. with resistors > electrically connecting electric components or wires to printed circuits > by soldering
Of 8 combined children, 7 exist in both systems.
1 codes are CPC-only extensions.
IPC defines codes here since 2026.
Child Classifications
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- H05K 3/346 Solder materials or compositions specially adapted therefor since 2026 IPC+CPC Available in IPC and CPC
- H05K 3/3489 Composition of fluxes; Application thereof; Other processes of activating the contact surfaces since 2026 IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class H05,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 7,201
- PANASONIC INTELLECTUAL PROPERTY 6,828
- SEMICONDUCTOR ENERGY LABORATORY COMPANY 3,988
- LG ELECTRONICS KR 3,564
- PANASONIC INTELLECTUAL PROPERTY JP 3,533
- SAMSUNG DISPLAY KR 3,310
- FUJI JP 2,870
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 2,675
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 2,665
- MURATA MANUFACTURING COMPANY JP 2,634
Top Applicants (CPC)
Class H05,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907