DIFF Subgroup
H05K 3/3478 Application of solder preforms; Transferring prefabricated solder patterns
Introduced: January 2026
Full Title
Apparatus or processes for manufacturing printed circuits > Assembling printed circuits with electric components, e.g. with resistors > electrically connecting electric components or wires to printed circuits > by soldering > Application of solder > Application of solder preforms; Transferring prefabricated solder patterns
No child classifications to compare. This is a leaf node in both IPC and CPC.