Application of solder paste, slurry or powder (using printing techniques to form the desired conductive pattern of the printed circuit by applying conductive material H05K3/12)

Introduced: January 2026

Title

Titles differ between systems:

IPC: Application of solder paste, slurry or powder

CPC: Application of solder paste, slurry or powder (using printing techniques to form the desired conductive pattern of the printed circuit by applying conductive material H05K3/12)

Full Title

Full titles differ between systems:

IPC:

CPC:

Apparatus or processes for manufacturing printed circuits > Assembling printed circuits with electric components, e.g. with resistors > electrically connecting electric components or wires to printed circuits > by soldering > Application of solder > Application of solder paste, slurry or powder (using printing techniques to form the desired conductive pattern of the printed circuit by applying conductive material H05K3/12)

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class H05,2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG ELECTRONICS COMPANY KR 7,201
PANASONIC INTELLECTUAL PROPERTY 6,828
SEMICONDUCTOR ENERGY LABORATORY COMPANY 3,988
LG ELECTRONICS KR 3,564
PANASONIC INTELLECTUAL PROPERTY JP 3,533
SAMSUNG DISPLAY KR 3,310
FUJI JP 2,870
SAMSUNG ELECTRO-MECHANICS COMPANY KR 2,675
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 2,665
MURATA MANUFACTURING COMPANY JP 2,634

Top Applicants (CPC)

Class H05,2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG ELECTRONICS COMPANY KR 9,981
SAMSUNG DISPLAY KR 5,041
LG ELECTRONICS KR 4,742
PHILIP MORRIS PRODUCTS CH 4,411
PANASONIC INTELLECTUAL PROPERTY JP 3,915
PANASONIC INTELLECTUAL PROPERTY 3,471
SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
MURATA MANUFACTURING COMPANY JP 3,191
FUJI JP 2,987
SIGNIFY HOLDING NL 2,907