DIFF Subgroup
H10P 72/76 using mechanical means, e.g. clamps or pinches
Introduced: January 2026
Full Title
Handling or holding of wafers, substrates or devices during manufacture or treatment thereof > for supporting or gripping > using mechanical means, e.g. clamps or pinches
Of 2 combined children, 0 exist in both systems.
2 codes are CPC-only extensions.
Child Classifications
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