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PCE
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DIFF Subgroup
H10P 72/78

using vacuum or suction, e.g. Bernoulli chucks

Introduced: January 2026

Full Title

Handling or holding of wafers, substrates or devices during manufacture or treatment thereof > for supporting or gripping > using vacuum or suction, e.g. Bernoulli chucks

No child classifications to compare. This is a leaf node in both IPC and CPC.