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IPC Subgroup
H10P 72/76

using mechanical means, e.g. clamps or pinches

Introduced: January 2026

Full Title

Handling or holding of wafers, substrates or devices during manufacture or treatment thereof > for supporting or gripping > using mechanical means, e.g. clamps or pinches

Classification Context

Section:
ELECTRICITY
Class:
SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
Subclass:
GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS