IPC Subgroup
H10P 72/78 using vacuum or suction, e.g. Bernoulli chucks
Introduced: January 2026
Full Title
Handling or holding of wafers, substrates or devices during manufacture or treatment thereof > for supporting or gripping > using vacuum or suction, e.g. Bernoulli chucks
Classification Context
- Section:
- ELECTRICITY
- Class:
- SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- Subclass:
- GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS