DIFF Subgroup
H10W 20/48 Insulating materials thereof
Introduced: January 2026
Full Title
Interconnections in chips, wafers or substrates > Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes > characterised by their insulating parts > Insulating materials thereof
No child classifications to compare. This is a leaf node in both IPC and CPC.