DIFF Subgroup
H10W 20/45 characterised by their insulating parts
Introduced: January 2026
Full Title
Interconnections in chips, wafers or substrates > Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes > characterised by their insulating parts
Of 4 combined children, 3 exist in both systems.
1 codes are CPC-only extensions.
IPC defines codes here since 2026.
Child Classifications
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- H10W 20/47 comprising two or more dielectric layers having different properties, e.g. different dielectric constants since 2026 IPC+CPC Available in IPC and CPC