H10W 70/096 — IPC vs CPC Diff | Patent Classification Explorer

DIFF Subgroup

H10W 70/096

Full Title

Package substrates; Interposers; Redistribution layers [RDL] > Manufacture or treatment > of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)

This code exists only in CPC.

Diff view requires codes present in both systems.

View in CPC →