DIFF Subgroup
H10W 70/01 Manufacture or treatment
Introduced: January 2026
Full Title
Package substrates; Interposers; Redistribution layers [RDL] > Manufacture or treatment
IPC and CPC are identically structured here. All 3 subcodes exist in both systems.
2 shared codes have differing titles between IPC and CPC.
IPC defines codes here since 2026.
Child Classifications
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- H10W 70/02 of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) since 2026 +2 CPC IPC+CPC Available in IPC and CPC
- H10W 70/05 of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) since 2026 +6 CPC IPC+CPC Available in IPC and CPC