of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)

Introduced: January 2026

Title

Titles differ between systems:

IPC: of insulating or insulated package substrates, or of interposers, or of redistribution layers

CPC: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)

Full Title

Full titles differ between systems:

IPC:

Package substrates; Interposers; Redistribution layers [RDL] > Manufacture or treatment > of insulating or insulated package substrates, or of interposers, or of redistribution layers

CPC:

Package substrates; Interposers; Redistribution layers [RDL] > Manufacture or treatment > of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)

CPC subdivides this area 4x more granularly than IPC with 6 additional codes.

6 codes are CPC-only extensions.

IPC defines codes here since 2026.

Child Classifications

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H10W 70/06 using temporary auxiliary supports since 2026 IPC+CPC Available in IPC and CPC
H10W 70/08 by depositing layers on the chip or wafer, e.g. "chip-first" RDLs since 2026 IPC+CPC Available in IPC and CPC
H10W 70/092 CPC only CPC only
H10W 70/093 CPC only CPC only
H10W 70/095 CPC only CPC only
H10W 70/096 CPC only CPC only
H10W 70/097 CPC only CPC only
H10W 70/098 CPC only CPC only