DIFF Subgroup
H10W 70/60 Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
Introduced: January 2026
Title
Titles differ between systems:
IPC: Insulating or insulated package substrates; Interposers; Redistribution layers
CPC: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
Full Title
Full titles differ between systems:
IPC:
Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers
CPC:
Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
Of 4 combined children, 2 exist in both systems.
2 codes are CPC-only extensions.
IPC defines codes here since 2026.
Child Classifications
Navigate with arrow keys, Enter to open
- H10W 70/62 characterised by their interconnections since 2026 +2 CPC IPC+CPC Available in IPC and CPC
- H10W 70/67 characterised by their insulating layers or insulating parts since 2026 +1 CPC IPC+CPC Available in IPC and CPC