H10W 70/611 — IPC vs CPC Diff | Patent Classification Explorer

DIFF Subgroup

H10W 70/611

Full Title

Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)

Of 2 combined children, 0 exist in both systems.

2 codes are CPC-only extensions.

This code exists only in CPC.

Diff view requires codes present in both systems.

View in CPC →