DIFF Subgroup
H10W 70/63 Vias, e.g. via plugs
Introduced: January 2026
Full Title
Full titles differ between systems:
IPC:
Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers > characterised by their interconnections > Vias, e.g. via plugs
CPC:
Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) > characterised by their interconnections > Vias, e.g. via plugs
Of 1 combined children, 0 exist in both systems.
1 codes are CPC-only extensions.
Child Classifications
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