DIFF Subgroup
H10W 70/69 Insulating materials thereof
Introduced: January 2026
Full Title
Full titles differ between systems:
IPC:
Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers > characterised by their insulating layers or insulating parts > Insulating materials thereof
CPC:
Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) > characterised by their insulating layers or insulating parts > Insulating materials thereof
IPC and CPC are identically structured here. All 3 subcodes exist in both systems.
IPC defines codes here since 2026.
Child Classifications
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- H10W 70/698 Semiconductor materials that are electrically insulating, e.g. undoped silicon since 2026 IPC+CPC Available in IPC and CPC