DIFF Subgroup
H10W 70/695 Organic materials
Introduced: January 2026
Full Title
Full titles differ between systems:
IPC:
Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers > characterised by their insulating layers or insulating parts > Insulating materials thereof > Organic materials
CPC:
Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) > characterised by their insulating layers or insulating parts > Insulating materials thereof > Organic materials
No child classifications to compare. This is a leaf node in both IPC and CPC.