Handling or holding of wafers, substrates or devices during manufacture or treatment thereof

Classification Context

Section:

ELECTRICITY

Class:

SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

Subclass:

GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS

Child Classifications

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• H10P 72/1 using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
• H10P 72/3 for conveying, e.g. between different workstations
• H10P 72/5 for positioning, orientation or alignment
• H10P 72/7 for supporting or gripping