IPC Subgroup
H10P 72/1 using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
Introduced: January 2026
Full Title
Handling or holding of wafers, substrates or devices during manufacture or treatment thereof > using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
Classification Context
- Section:
- ELECTRICITY
- Class:
- SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- Subclass:
- GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS