of conductive package substrates serving as an interconnection, e.g. of metal plates

Full Title

Package substrates; Interposers; Redistribution layers [RDL] > Manufacture or treatment > of conductive package substrates serving as an interconnection, e.g. of metal plates

Classification Context

Section:

ELECTRICITY

Class:

SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

Subclass:

GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS