CPC Subgroup
H10W 70/02 of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04)
Full Title
Package substrates; Interposers; Redistribution layers [RDL] > Manufacture or treatment > of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04)
2 direct subcodes
Child Classifications
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