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PCE
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DIFF Subgroup
H10W 70/02

of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04)

Introduced: January 2026

Title

Titles differ between systems:

IPC: of conductive package substrates serving as an interconnection, e.g. of metal plates

CPC: of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04)

Full Title

Full titles differ between systems:

IPC:

Package substrates; Interposers; Redistribution layers [RDL] > Manufacture or treatment > of conductive package substrates serving as an interconnection, e.g. of metal plates

CPC:

Package substrates; Interposers; Redistribution layers [RDL] > Manufacture or treatment > of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04)

Of 2 combined children, 0 exist in both systems.

2 codes are CPC-only extensions.

Child Classifications

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