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IPC Subgroup
H10W 70/06

using temporary auxiliary supports

Introduced: January 2026

Full Title

Package substrates; Interposers; Redistribution layers [RDL] > Manufacture or treatment > of insulating or insulated package substrates, or of interposers, or of redistribution layers > using temporary auxiliary supports

Classification Context

Section:
ELECTRICITY
Class:
SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
Subclass:
GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS