of insulating or insulated package substrates, or of interposers, or of redistribution layers

Full Title

Package substrates; Interposers; Redistribution layers [RDL] > Manufacture or treatment > of insulating or insulated package substrates, or of interposers, or of redistribution layers

Classification Context

Section:

ELECTRICITY

Class:

SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

Subclass:

GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS

Child Classifications

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• H10W 70/06 using temporary auxiliary supports
• H10W 70/08 by depositing layers on the chip or wafer, e.g. "chip-first" RDLs