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PCE
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DIFF Subgroup
H10W 70/06

using temporary auxiliary supports

Introduced: January 2026

Full Title

Full titles differ between systems:

IPC:

Package substrates; Interposers; Redistribution layers [RDL] > Manufacture or treatment > of insulating or insulated package substrates, or of interposers, or of redistribution layers > using temporary auxiliary supports

CPC:

Package substrates; Interposers; Redistribution layers [RDL] > Manufacture or treatment > of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) > using temporary auxiliary supports

No child classifications to compare. This is a leaf node in both IPC and CPC.