CPC Subgroup
H10W 70/01 Manufacture or treatment
Full Title
Package substrates; Interposers; Redistribution layers [RDL] > Manufacture or treatment
3 direct subcodes
Child Classifications
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- H10W 70/02 of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04)
- H10W 70/04 of leadframes
- H10W 70/05 of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)