CPC Subgroup
H10W 70/05 of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
Full Title
Package substrates; Interposers; Redistribution layers [RDL] > Manufacture or treatment > of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
8 direct subcodes
Child Classifications
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- H10W 70/06 using temporary auxiliary supports
- H10W 70/08 by depositing layers on the chip or wafer, e.g. "chip-first" RDLs