Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

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Interconnections or connectors in packages > Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Child Classifications

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• H10W 72/221
• H10W 72/231
• H10W 72/241
• H10W 72/251
• H10W 72/261
• H10W 72/281
• H10W 72/29 Bond pads specially adapted therefor