DIFF Subgroup
H10D 84/02 characterised by using material-based technologies
Introduced: January 2025
Full Title
Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers > Manufacture or treatment > characterised by using material-based technologies
IPC and CPC are identically structured here. All 4 subcodes exist in both systems.
IPC defines codes here since 2025.
Child Classifications
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- H10D 84/03 using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology since 2025 +3 CPC IPC+CPC Available in IPC and CPC
- H10D 84/08 using combinations of technologies, e.g. using both Si and SiC technologies or using both Si and Group III-V technologies since 2025 IPC+CPC Available in IPC and CPC