Conductive materials thereof

Introduced: January 2026

Full Title

Interconnections in chips, wafers or substrates > Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes > characterised by their conductive parts > Conductive materials thereof

Of 5 combined children, 0 exist in both systems.

5 codes are CPC-only extensions.

Child Classifications

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H10W 20/4403 +4 CPC CPC only CPC only
H10W 20/4451 CPC only CPC only
H10W 20/4462 CPC only CPC only
H10W 20/4473 CPC only CPC only
H10W 20/4484 CPC only CPC only