characterised by their conductive parts

Introduced: January 2026

Full Title

Interconnections in chips, wafers or substrates > Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes > characterised by their conductive parts

CPC subdivides this area 3x more granularly than IPC with 5 additional codes.

5 codes are CPC-only extensions.

IPC defines codes here since 2026.

Child Classifications

Navigate with arrow keys, Enter to open

H10W 20/42 Vias, e.g. via plugs since 2026 +2 CPC IPC+CPC Available in IPC and CPC
H10W 20/423 CPC only CPC only
H10W 20/425 CPC only CPC only
H10W 20/427 CPC only CPC only
H10W 20/43 Layouts of interconnections since 2026 +1 CPC IPC+CPC Available in IPC and CPC
H10W 20/435 CPC only CPC only
H10W 20/438 CPC only CPC only
H10W 20/44 Conductive materials thereof since 2026 +5 CPC IPC+CPC Available in IPC and CPC