DIFF Subgroup
H10W 20/4403 Full Title
Interconnections in chips, wafers or substrates > Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes > characterised by their conductive parts > Conductive materials thereof
Of 4 combined children, 0 exist in both systems.
4 codes are CPC-only extensions.