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PCE
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DIFF Subgroup
H10W 70/08

by depositing layers on the chip or wafer, e.g. "chip-first" RDLs

Introduced: January 2026

Full Title

Full titles differ between systems:

IPC:

Package substrates; Interposers; Redistribution layers [RDL] > Manufacture or treatment > of insulating or insulated package substrates, or of interposers, or of redistribution layers > by depositing layers on the chip or wafer, e.g. "chip-first" RDLs

CPC:

Package substrates; Interposers; Redistribution layers [RDL] > Manufacture or treatment > of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) > by depositing layers on the chip or wafer, e.g. "chip-first" RDLs

IPC and CPC are identically structured here. All 1 subcodes exist in both systems.

IPC defines codes here since 2026.

Child Classifications

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  • H10W 70/09 extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs since 2026 IPC+CPC Available in IPC and CPC