DIFF Subgroup
H10W 70/66 Conductive materials thereof
Introduced: January 2026
Full Title
Full titles differ between systems:
IPC:
Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers > characterised by their interconnections > Conductive materials thereof
CPC:
Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) > characterised by their interconnections > Conductive materials thereof
Of 4 combined children, 0 exist in both systems.
4 codes are CPC-only extensions.
Child Classifications
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