Skip to content
PCE
Search Classifications
Search for IPC and CPC classification codes or keywords
DIFF Subgroup
H10W 90/20

Configurations of stacked chips

Introduced: January 2026

Full Title

Package configurations > Configurations of stacked chips

CPC subdivides this area 3x more granularly than IPC with 8 additional codes.

8 codes are CPC-only extensions.

IPC defines codes here since 2026.

Child Classifications

Navigate with arrow keys, Enter to open

  • H10W 90/22 the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL since 2026 IPC+CPC Available in IPC and CPC
  • H10W 90/231 CPC only CPC only
  • H10W 90/24 at least one of the stacked chips being laterally offset from a neighbouring stacked chip, e.g. chip stacks having a staircase shape since 2026 IPC+CPC Available in IPC and CPC
  • H10W 90/26 the stacked chips being of the same size without any chips being laterally offset, e.g. chip stacks having a rectangular shape since 2026 IPC+CPC Available in IPC and CPC
  • H10W 90/271 CPC only CPC only
  • H10W 90/275 CPC only CPC only
  • H10W 90/28 the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape since 2026 IPC+CPC Available in IPC and CPC
  • H10W 90/284 CPC only CPC only
  • H10W 90/288 CPC only CPC only
  • H10W 90/291 CPC only CPC only
  • H10W 90/297 CPC only CPC only