Configurations of stacked chips

Child Classifications

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• H10W 90/22 the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL since 2026 IPC+CPC Available in IPC and CPC
• H10W 90/231 CPC only CPC only
• H10W 90/24 at least one of the stacked chips being laterally offset from a neighbouring stacked chip, e.g. chip stacks having a staircase shape since 2026 IPC+CPC Available in IPC and CPC
• H10W 90/26 the stacked chips being of the same size without any chips being laterally offset, e.g. chip stacks having a rectangular shape since 2026 IPC+CPC Available in IPC and CPC
• H10W 90/271 CPC only CPC only
• H10W 90/275 CPC only CPC only
• H10W 90/28 the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape since 2026 IPC+CPC Available in IPC and CPC
• H10W 90/284 CPC only CPC only
• H10W 90/288 CPC only CPC only
• H10W 90/291 CPC only CPC only
• H10W 90/293 +1 CPC CPC only CPC only
• H10W 90/297 CPC only CPC only