Fan-out layouts

Introduced: January 2026

Full Title

Full titles differ between systems:

IPC:

Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers > characterised by their interconnections > Shapes or dispositions of interconnections > Top-view layouts > Fan-out layouts

CPC:

Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) > characterised by their interconnections > Shapes or dispositions of interconnections > Top-view layouts > Fan-out layouts

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class H10,2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG DISPLAY KR 21,044
SAMSUNG ELECTRONICS COMPANY KR 14,774
LG DISPLAY COMPANY KR 9,454
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 8,301
SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 7,642
BOE TECHNOLOGY GROUP COMPANY 6,845
BOE TECHNOLOGY GROUP COMPANY CN 6,806
SAMSUNG DISPLAY 6,577
LG CHEM KR 5,461
SEMICONDUCTOR ENERGY LABORATORY COMPANY 5,115

Top Applicants (CPC)

Class H10,2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG DISPLAY KR 38,446
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 30,922
SAMSUNG ELECTRONICS COMPANY KR 30,059
BOE TECHNOLOGY GROUP COMPANY CN 20,304
LG DISPLAY COMPANY KR 17,772
BOE TECHNOLOGY GROUP COMPANY 15,621
SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 13,629
IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 11,750
SAMSUNG DISPLAY 11,316
SEMICONDUCTOR ENERGY LABORATORY COMPANY 9,697