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PCE
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DIFF Subgroup
H10W 70/656

Fan-in layouts

Introduced: January 2026

Full Title

Full titles differ between systems:

IPC:

Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers > characterised by their interconnections > Shapes or dispositions of interconnections > Top-view layouts > Fan-in layouts

CPC:

Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) > characterised by their interconnections > Shapes or dispositions of interconnections > Top-view layouts > Fan-in layouts

No child classifications to compare. This is a leaf node in both IPC and CPC.